Cold high power high voltage inverter for eaf

Cold high power high voltage inverter

Abstract:The problem of heat dissipation is an important part of high-power and high-voltage inverter. This paper mainly introduces the advantages of heat dissipation of water-cooled high-voltage inverter and its practical application.

1、 Introduction

With the wide application of high-voltage inverter in various industries, more and more attention has been paid to the application problems of system safety and equipment stability brought by the application of high-voltage inverter. In addition to solving the system stability of high-voltage inverter, the heat dissipation problem of inverter body should also be solved, which is an important part of ensuring the safe operation of inverter.At present, air cooling is the main heat dissipation mode of high voltage inverter in China.With the increase of inverter power, air cooling can not meet the requirements of inverter heat dissipation, and to solve the problem of high-power inverter heat dissipation, water cooling is undoubtedly the best way of heat dissipation.At present, only a few manufacturers have application achievements in high-power water-cooled high-voltage inverter. The successful application of Hekang 7400kw water-cooled inverter in Xinda steel plant of Qian'an City, Hebei Province marks that Hekang has made a new breakthrough in high-power water-cooled high-voltage inverter and improved the company's competitive strength in the industry.

2、 Comparison of cooling methods between water cooling and air cooling

The installation of high-voltage inverter requires the ambient temperature of - 5 ℃ ~ 45 ℃.A large number of studies show that the failure rate of high-voltage inverter increases with the increase of temperature, the service life decreases with the increase of temperature, and the service life of high-voltage inverter will be halved when the ambient temperature increases by 10 ℃.A lot of high-precision electronic components are used in the high-voltage inverter. Among the factors that affect the reliability of power electronic devices, heat dissipation is the most important one.The heat generated by high-power semiconductor devices will lead to the rise of chip temperature. If there is no proper heat dissipation measures, the chip temperature may exceed the maximum allowable temperature value, resulting in the deterioration of device performance and damage.Therefore, in the circuit design, the selection of appropriate heat dissipation mode and reasonable design is one of the important links to make the potential of the device fully play and improve the reliability of the circuit.